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LITHO MASKLESS is maskless lithography equipment, based on a dynamic mask technology using TI’s 0.65” DMD (Digital Mirror Device) and an upright microscope system, compatible with a wide range of resists and substrates. The system can expose any 2D or 2.5D shapes at micron resolution without an expensive hard mask.
Quick and easy to use
Adjustable
pattern size and resolution
Compatible
with various microscopes
High intensity
and high resolution
Easy alignment (EasyalignTM)
AI based uniformity
compensation (AIUniBeamTM)
PLANCK_Maskless_Module_edited
PLANCK_Maskless_with_BX53M_edited
Nikon Eclipse LV version
PLANCK_Maskless_Module_edited
1/3
Specifications
Pattern Generator | 0.65" DMD |
Pattern Pixel | 1920 x 1080 |
Radiometric Flux | 4 W |
Wavelength | 365nm / 385nm / 405nm |
Intensity | Max 4.0W/cm2 @20x |
Uniformity | > 90 % |
Pattern Format | PNG |
OS | Windows |
Lens Specificaitons
Objective Lens | 5x | 10x | 20x | 50x | 100x |
|---|---|---|---|---|---|
NA | 0.15 | 0.3 | 0.45 | 0.8 | 0.9 |
Pattern Size(μm) | 2903x1633 | 1452x816 | 726x408 | 290x163 | 145x82 |
CD(μm) | 3.29 | 1.65 | 1.24 | 0.82 | 0.62 |
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The specifications is from Olympus system (Olympus BX53)
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CD(Critical Dimension) is estimated value at 405nm
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LITHO MASKLESS is optimzed in 20x objective lens system
Applications
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